Electronics Forum | Thu Jul 15 16:29:49 EDT 1999 | Charles Morris
We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow profi
Electronics Forum | Mon May 12 22:40:19 EDT 2003 | nyazga
I have always heard to use solder with 2 percent silver to reduce gold embrittlment. One vendor site said this is a myth. Does anyone know of a specific document recommending this such as IPC or MIL spec. ???
Electronics Forum | Mon Sep 29 23:46:51 EDT 2003 | daman
Hello everybody, We have a new product having a lot of open gold area. solder splashes during the reflow is a pain in the... Its an extremely small PCB and kapton taping is not an option. Stencil is at 10% reduction, Cleaning after every cycle. Reflo
Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David
I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?
Electronics Forum | Fri Jan 20 10:27:22 EST 2006 | sparrow
Hello David, No, the capillary does not scrub through the gold layer. At least, we have never seen it. We replace the capillary after approx. 200k bonds. Regards, Sergey
Electronics Forum | Tue Jun 13 08:17:06 EDT 2006 | davef
The solder alloy does not change based on the flux. Your potential for embrittlement is the same [providing the metal of the solders are the same] with either solder. We would guess the OA flux is [and drag tinning are] removing corrosion from the
Electronics Forum | Thu Jul 20 02:42:34 EDT 2006 | Francis
Short term, taped the gold finger. long term, study the air flow of the reflow section of the oven. It is always being overlook at this part and lookout for the printer. The air flow must be laminar and properly flowed back.
Electronics Forum | Thu Jul 20 03:00:53 EDT 2006 | reypal
If you are using SMT machine for component placement you may check your nozzle where in some cases solder paste stuck to it and during placement will easily get into gold pad area. otherwise you have use kapton tape in order not to expose those pads.
Electronics Forum | Wed Nov 10 16:03:07 EST 2010 | davef
Were the gold surfaces acceptable: * At incoming inspection * After first reflow ... How do know this issue was caused by the second reflow?
Electronics Forum | Thu Nov 11 14:29:18 EST 2010 | davef
When you say 'tarnished,' is that based on: * Appearance of the gold over-plate * That you can't get good contact during ATE processing ... OR ... * Something else?
