Electronics Forum | Fri Jul 11 08:17:22 EDT 2008 | aj
Hi Dave, Yes that is correct. I had a XRF carried out on some boards that I am having solderability issues on and the report came back with 0.04um - 0.05um as the measured gold thickness. Previous batches that went through fine measured 0.07-0.11u
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Tue Jan 20 10:30:56 EST 2009 | milas
Hi We have just specified the following thicknesses for the Nickel and Gold on an ENIG finish board. The baord is to be manufactured using a lead - free process. My question: Is the thickness we've specificed likely to gie us any issues during manuf
Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab
We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi
Electronics Forum | Fri Mar 05 12:25:02 EST 2010 | leemeyer
Hi all I have an opportunity to purchase a lightly used Super M.O.L.E Gold profiler along with the Auto Mole Xpert oven setup package. Can I get some opinions on how well the predictor and oven setup works. Also is the software user friendly? I would
Electronics Forum | Tue Mar 09 10:39:51 EST 2010 | baildl632
We purchased a "Promotional Unit" (Super Mole Gold w/ power pack only) w/ 6 mo. warrany from ECD directly in '06' for $3395.00. My opinion of its function is excellent. The Predictor function works well, giving very close predictions. I tend to do my
Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps
Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone
Electronics Forum | Tue Jan 04 10:37:48 EST 2011 | johanhuizing
Hi Mike, We only are using ENIG not hard gold, we are using edge contacts but the connectors will only be removed if the product is being replaced, normal life time for the equipment where the electronics is build-in is 15 years. Also the electronic
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
Electronics Forum | Fri Jun 27 13:02:28 EDT 2014 | spitkis2
Is this fluxed / solder paste or flux-less reflow process? Are you soldering in a nitrogen or vacuum oven? From my experience having gold-tin connections go through reflow a 2nd time does not yield defects or quality issues. However, I cannot comm
