Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Wed Dec 20 16:54:28 EST 2000 | ronh
Question: How many insertion/removal cycles can be expected of gold finger contacts? Problem: We manufacture a class 2 PCBA with gold finger contacts whose application will require repeated insertion and removal into card edge connectors (mother b
Electronics Forum | Wed Dec 20 16:54:07 EST 2000 | ronh
Question: How many insertion/removal cycles can be expected of gold finger contacts? Problem: We manufacture a class 2 PCBA with gold finger contacts whose application will require repeated insertion and removal into card edge connectors (mother b
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Apr 17 08:29:12 EDT 2001 | Geertjan de Beijer
My name is Geertjan de Beijer and I am new on this forum. I have a question about Electroless Nickel/Gold finishes. Until now we always use a HAL finish on our PCB's. Since we are using compontents with pitches of 0.5mm we notice that the HAL finis
Electronics Forum | Tue May 29 20:26:38 EDT 2001 | davef
I never heard anyone say anything about looking for telecom wear surface spec, what point did I miss? Have you contacted the folk at old Bell Labs [http://www.bell-labs.com Er, whatever they're called now a days?] From a different perspective, we
Electronics Forum | Wed Jun 30 17:58:01 EDT 1999 | Boca
| My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side it wo
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
