Electronics Forum: gold and flash and ipc (Page 1 of 2)

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas

We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob

soldering and bonding on gold PCB's

Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef

For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia

Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

OSP and Gold Flash Spec.

Electronics Forum | Mon Jul 20 17:04:44 EDT 1998 | Richard Jackson

Can someone point me to where I can get a copy of the spec for these finishes. Thanks Richard Jackson richardj@tanisys.com Jackson_Richard@csi.com

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike Mike, We and ind

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike There has b

Re: OSP and Gold Flash Spec.

Electronics Forum | Wed Aug 12 13:11:37 EDT 1998 | Tyler Posey

Can someone point me to where I can get a copy of the spec for these finishes. Thanks Richard Jackson richardj@tanisys.com Jackson_Richard@csi.com Richard We have also been looking into OSP's. Enthone-OMI is a source for anything you ne

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko

Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: HASL OSP ENIG Pd Tin Silver Flat no yes yes yes yes yes Solderjoint Cu-Sn Cu-Sn Ni-Sn Ni-Sn Cu-Sn Cu-Sn Contact E-test, ICT no

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