Electronics Forum: gold ball bond flex (Page 1 of 3)

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

gold wire bonding

Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris

The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris

I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c

Re: soldering to hard gold plated PCBs

Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.

Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

wirebonding

Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

Dummy Parts for Gold Wire Bonding for Practice

Electronics Forum | Thu Feb 26 10:06:12 EST 2009 | bandjwet

Does anyone know of any vendors who can supply "dummy" parts to practice ball wire bonding of gold to help train/certify operators? Thanks BWET

wirebonding

Electronics Forum | Wed Sep 07 17:14:11 EDT 2005 | GS

finest pitch requires ball bonding (gold) GS

ENEPIG

Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit

Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower

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