Electronics Forum: gold flash ipc (Page 1 of 24)

minimum thickness - Gold flash finish

Electronics Forum | Thu Sep 20 14:20:46 EDT 2012 | blnorman

From what I was told, gold flash normally refers to 10 microinches of gold.

minimum thickness - Gold flash finish

Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef

Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c

minimum thickness - Gold flash finish

Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday

The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u

minimum thickness - Gold flash finish

Electronics Forum | Thu Sep 20 10:05:35 EDT 2012 | guyramsey

What is the state of the art in electroplated gold flash a a surface finish; thickness and tolerance limits?

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef

As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 20:32:10 EDT 2004 | davef

First, we didn't say "electrolytic soft gold with a minimum thickness of 5-8 of Au". We said, "'electrolytic soft gold' thickness 5 to 8uin". FOCUS. ;-) Second, we're unaware of an industry accepted specification that you can reference. IPC-2221

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

gold wire bonding

Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris

I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu

62sn36sn2ag on gold terminations?

Electronics Forum | Mon May 12 22:40:19 EDT 2003 | nyazga

I have always heard to use solder with 2 percent silver to reduce gold embrittlment. One vendor site said this is a myth. Does anyone know of a specific document recommending this such as IPC or MIL spec. ???

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