Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Fri Apr 13 13:45:25 EDT 2001 | gsmguru
Just a guess-- Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape ? This should be easy to verify. Otherwise it sounds like things are pretty much covered.
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
Electronics Forum | Tue Jul 18 22:11:13 EDT 2006 | davef
Aping Russ' reply: * ~70% of the time solder on gold fingers is caused by poor printing and handling processes. * ~25% of the time solder on gold fingers is caused by poor thermal recipe when soldering. * ~5% of the time solder on gold fingers is cau
Electronics Forum | Tue Sep 30 14:16:49 EDT 2003 | davef
While your waiting for others to respond, search to fine SMTnet Archives on: "solder and gold and finger"
Electronics Forum | Tue Jul 18 10:08:19 EDT 2006 | pms
kapton tape the gold fingers before reflow.........
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
