Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave
Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro
Electronics Forum | Mon Apr 26 09:11:04 EDT 2004 | Daniel
Thanks, We currently use Metcals for our regular work and I was looking at the ERSA system for the BGA rework. From what I have seen it seems simple to use, and since it uses IR you don�t need all the attachments for different size BGA�s. You just
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Mon Apr 26 15:04:14 EDT 2004 | pjc
You are correct in understanding that the vision system comes into play for subsequent boards- to align them. Yes- if you missalign the first board and set the cameras to that board, all subsequet boards will not be aligned. Mylar is a thin polyester
Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt
Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec
Electronics Forum | Tue May 04 15:18:45 EDT 2004 | msjohnston1
Ricardo makes some good points. My idea of a dream line is one that flexible to run as a high mix/low vol and low mix/high vol. I personally like Dek printers over MPM. The new printers from Mulara look interesting but they are a new company with a
Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
Electronics Forum | Mon May 10 09:30:35 EDT 2004 | davef
Q1: What are the basic requirements of thermal profiling? A1: Not sure what you�re looking for here, but when doing a profile, you�re trying to measure the temperature at specific points of the board, as the board moves through the oven. Q2: How we
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc
I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to
.gif)
