Electronics Forum | Fri Aug 13 08:14:38 EDT 1999 | Peter Barton
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Fri Aug 13 10:00:45 EDT 1999 | Boca
| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme
Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon
| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav
Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM
| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou
Electronics Forum | Wed Aug 11 09:51:11 EDT 1999 | Brian
| | | Easy goods-in polymerisation check: clean, white, cotton cloth: wrap it round a suitably gloved finger and pour a few drops of methylene chloride (! toxic) onto the end of the finger and rub it onto the bare board for a minute or so. If it come
Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW
| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Tue Jul 20 19:09:25 EDT 1999 | JohnW
| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas
Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy
| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p
