Electronics Forum: good (Page 236 of 1214)

Draining a Solder Pot-

Electronics Forum | Tue Sep 27 17:25:12 EDT 2005 | scombs

Hi Jay, Have you used those methods before? The muffin tin is a good idea as long as you buy enough. Thanks

Draining a Solder Pot-

Electronics Forum | Wed Sep 28 13:26:36 EDT 2005 | Jay Brower

Yes, I've used the muffin tins. I drained a solder drag pot. Steve makes a good point about the drain valve. When I drain my pot, I will be scooping out the solder and filling my tins.

Draining a Solder Pot-

Electronics Forum | Tue Feb 21 17:04:09 EST 2006 | GS

Hi Marcus, how are you enjoing SN100 ? It seams the SN100's good reputation is growing day by day, is true also for you? Many thanks Best Regards...........GS

SMT MACHINES

Electronics Forum | Mon Oct 03 09:54:48 EDT 2005 | PWH

Yea, we've bought lots of feeders from these guys and had good luck and response - they seem always able to meet a tight date and I think they will even rent feeders for special jobs if needed. (I have no affiliation with them).

SMT MACHINES

Electronics Forum | Mon Oct 17 15:53:12 EDT 2005 | ricardof

mmh, good point, our current board is not that big, however, I'm wondering what is a common derate number on big boards?

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

Water Jet Stencil Cut

Electronics Forum | Sun Oct 09 01:11:34 EDT 2005 | vev

There is a stencil cutting machine in the industry which utilizes a water jet to deliver a Laser beam for cutting stencils. There are no machines of this type in the states. The quality is no better than a Laser cut stencil using a good Laser System.

LF BGA Tests

Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks

Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?

Mydata technical support ?

Electronics Forum | Fri Oct 07 07:43:40 EDT 2005 | cyber_wolf

I am curious to hear what kinds of experiences you Mydata users have had with Mydata technical support... Good?...Bad?...Impartial?..

Same wave process do not apply to all finish board

Electronics Forum | Mon Oct 17 08:16:03 EDT 2005 | lyrtech

Thanks Patrick. I understand your points. It gives us good results. I didn't know about the flux activity on Gold finish. It's a pleasure to get this kind of explanantion.


good searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Benchtop Fluid Dispenser
Selective soldering solutions with Jade soldering machine

Component Placement 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications