Electronics Forum: good (Page 356 of 1214)

No-Clean or water

Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin

No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than

No-Clean or water

Electronics Forum | Mon Jun 11 22:01:30 EDT 2001 | davef

Others make good points. Consider "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process" as a starting point. Remember that in-bound components and boards can be loaded with unNC res that can turn the best implemented

Component soldering strength ?

Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker

Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc

Component soldering strength ?

Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan

Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805

Unsoldered Component

Electronics Forum | Fri Aug 03 15:58:07 EDT 2001 | arsmoriendi

Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after i

Re: Flash Gold over Nickel - PCB finishing

Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F

Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP

Re: Touch up on 0603 Chips ( Ceramic caps)

Electronics Forum | Tue Feb 01 21:44:54 EST 2000 | Dave F

Ashok: A fine mess you gotten us into now!!! ;-) You have no good options. BEST OPTION: Get the customer to accept the boards "as is." Rework will only degrade the product. Agree to accept all liability related to this solder condition (which y

Re: NO CLEAN FLUX RESIDUE

Electronics Forum | Thu Jan 27 17:54:37 EST 2000 | Steve Harshbarger

Casimir, I have seen exactly what you are experiencing with the Kester 958 on other wave lines. No clean fluxes vary in how much flux residue is visually left behind. These no clean residues are typically not harmful to the PCB, but they are often

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Sat Jan 15 16:59:47 EST 2000 | Steve Thomas

Thanks, Mark. Actually we already have an established mark. We use 500ppm (99.95%) as our acceptable level. Problem is, someone (another manufacturer) told someone else (our pres.) that THEY build to 50ppm. Soooooo, someone else told my boss that

Re: gold fingers over wave

Electronics Forum | Thu Jan 13 13:16:40 EST 2000 | Dave F

Tony: You have choices: * Hi Temperature Tape: Go with Wolfgang ... too tough to control. * Selective Soldering Pallets: Some like 'em some don't. A lot of your success depends on the pallet fabricator. * Screenable Temporary Solder Mask: Wol


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