Electronics Forum: good (Page 421 of 1214)

How to measure N2 in reflow oven

Electronics Forum | Thu Mar 04 07:57:32 EST 1999 | John Godfrey

I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in atmospe

Re: What are the disadvantages of Paper Phernaulic besides its' spelling

Electronics Forum | Thu Feb 25 18:29:48 EST 1999 | Karl

| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Ther

Mechanical stencil foil tensioning

Electronics Forum | Wed Feb 24 01:08:10 EST 1999 | Joe Cameron

Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean sock

Re: Solder Balls

Electronics Forum | Thu Feb 18 08:35:10 EST 1999 | Dave F

| We have problems with solder balls after reflow. Anybody have any ideas as to what causes them? | Al: Tuffty's comments are good, but point to the broader problem in trying to make recommendations on your problem ... There's just not enough info

Re: Squeegee Pressure

Electronics Forum | Fri Feb 12 14:06:28 EST 1999 | Craig Lowe

Bill, I would go with the second piece of advice by leaving a little film of solder paste on the screen. This is good advise if you are using a lookup/look down type of vision centering. Like on MPM and newer Fuji. On older Fuji GSP2/3 style printer

BGA-Problems with adhesion of the solder balls

Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York

Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form

CpK kits for chip shooters

Electronics Forum | Mon Jan 18 18:08:38 EST 1999 | Jerry Stafford

I know there was some discussion a few months ago on this topic but I don't think a good solution was offered for checking CpK using chips using a chip shooter. I am looking for a way to measure this on our Fuji CP6-4000. Any suggestions? Jerry

Re: lead-free components

Electronics Forum | Mon Jan 18 21:34:02 EST 1999 | Kelvin Chow

| Hi, | I�m searching for manufactores of lead-free components (resistance, capacitors ...) | Do you know adresses, websides ... to get some information? | Please tell me. | Dear Marcus, You may contact Alpha guy to see if they will give you some i

Re: Hand soldering rework fluxes

Electronics Forum | Fri Jan 15 10:52:27 EST 1999 | John

| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav

HAPPY NEW YEAR

Electronics Forum | Thu Dec 31 07:04:31 EST 1998 | Wayne Bracy

To all the workers at the SMTNet just wishing you a happy new year. 1998 was a wonderful year for most of us and we can only hope that 1999 will be as good or even better. Really have enjoyed visiting the SMTNet forum and look forward to the new ad


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