Electronics Forum | Tue Nov 29 12:23:58 EST 2005 | JeffP
>Anyone can do good airflow with a little brains, and so >>delta t is important, but not the main weakness I see on >>batch convection. Actually it is a main weakness with batch and small conveyer ovens on the market. There must be a lot of people
Electronics Forum | Wed Nov 09 09:01:42 EST 2005 | smtspecialist
I was using a combination of Alcohol and then compressed air for a while because I didn't wanted to add new hazardous chemicals into my factory but after looking into Vigon SC200 with a H/F/R of 0 I decided to try it. Since I started to use it, my
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Thu Nov 17 17:32:07 EST 2005 | russ
Good point tommy, I think we are confusing what we are talking about here. It was not asked if the operators should do inspection. It was asked if an operator should pass boards through a machine. The operator is not inspecting anything just as t
Electronics Forum | Fri Dec 02 15:29:42 EST 2005 | mika
In my prior posting, I didn't exactly understood what You have in mind. I now understand that You want to get something for free, that everybody else need to pay for. If this is only for personal use so that You will be more skilled at Your work? Th
Electronics Forum | Tue Nov 29 16:30:05 EST 2005 | russ
We have utilized one of these for about 6mos. now (is that right Larry? I know you're reading this.) So far it has proven to be a very good machine. Getting the vision right on chip caps can be tricky and sometimes frustrating but once they are rig
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Mon Dec 05 14:32:05 EST 2005 | mo8080
Good Afternoon, Several of my customers own the Mirtec and they all have great things to say about it. You can also look at YesTech and Orbotech (But these may be a little more expensive). No Matter which machine you pick, I would love to be able
Electronics Forum | Thu Dec 08 08:22:58 EST 2005 | grantp
Hi, How fine pitch are you going? What kind of stencil printer are you using? We had a manual stencil printer and needed to print 1-mm pitch BGA and needed to go to laster cut and electro polish at 4 thou to get good paste release. We also went 1:1
