Electronics Forum: ground pad (Page 1 of 21)

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 16 14:11:16 EDT 2009 | davef

thermal and pad

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Thu Oct 15 11:04:28 EDT 2009 | spitkis2

Thanks Jim. Pressing the QFN into paste was what I thought of, just wasn't sure if it would cause solder paste to be pressed outside the pad area and possibly bridge with an adjacent pad. Do you recall the ratio of paste coverage to the pad area?

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 16 14:45:58 EDT 2009 | cyber_wolf

Many pick and place platforms rely on nozzle spring pressure to determine how hard a part is getting pushed into the paste.

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 09 00:57:05 EDT 2009 | jjmag921612000

SteveO, I had personal experience with this using a Panasonic MPAV2B. It took a while, but I believe the end result was to have some additional "Z" travel to press the QFN into the paste. Also, the design of the paste on the ground was key to keep t

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Wed Sep 30 13:10:49 EDT 2009 | spitkis2

Hi guys, Can someone please clarify whether adjustment of Z axis travel is a critical parameter during placement of QFN devices. If so, to within what tolerance? In other words, should a pick and place machine position a QFN down on the board so t

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Wed Oct 21 08:06:06 EDT 2009 | scottp

I agree with Dave. If the device has a lot of power we'll put thermal vias between the solder deposits with annular rings of soldermask to keep solder out of the holes. We've never had to mess with placement pressure. We've been using QFNs for yea

Treading on dangerous ground

Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach

| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 20:13:22 EST 2022 | dwl

They don't look that bad, especially for SN100. There is evidence of wetting on the toe and the paste on the pad seems to have reflowed properly. What does the heal look like? That's the more critical part of the solder joint for Gull leaded parts.

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef

Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:26:32 EST 2004 | Vinny

Hi Guys, Really need your help to suggest how to tackle this situation.

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