Electronics Forum: growth (Page 16 of 25)

MSL | Baking components after expired floor life

Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire

I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida

MLB PCB DIMENISIONAL STABILITY AND LAMINATE INTEGRITY

Electronics Forum | Fri Feb 27 10:54:38 EST 1998 | Earl Moon

REVISITING MULTILAYER DIMENSIONAL STABILITY AND LAMINATE INTEGRITY It has been said we must learn it all over again and again about every four years. I know Lee Ritchey said that to me about high speed digital circuit design. The same seems true for

Soldering issues lately!!

Electronics Forum | Thu Sep 11 11:34:52 EDT 2008 | patrickbruneel

Interesting observation Manuel. I will be blamed again for crying wolf but look below a lot more defects will soon see the daylight all related to lead-free. This information was posted at the tin whisker forum by Bob Landman of H&L Instruments.

how is the South America market for high speed pnp machine , why many usa clients want desktop pnp machine, mainl for rearch and

Electronics Forum | Wed Jul 22 07:20:12 EDT 2015 | spoiltforchoice

I'm not entirely sure that is accurate. The only people who want small 'desktop' machines are hobbyists/labs who are unable to accept the costs and time constraints placed upon them by a subcontractor and think they can do better themselves. Standalo

Sn/Pb diffusion

Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef

Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over

speedline sale

Electronics Forum | Wed Nov 05 19:40:25 EST 2003 | Mike Konrad

Here's the official press release... New York, NY (November 5, 2003) -- KPS Special Situations Fund II announced today that it has acquired the stock and related assets of Speedline Technologies, Inc. from Cookson Group, plc for a total consideratio

Lead Free Solder Wick

Electronics Forum | Fri Mar 10 00:17:47 EST 2006 | Samir

Patrick, My sardonic wit comes from 11 years of being an embattled process guy who�s basically �seen it all� in electronics manufacturing. I�ve been witness to the �Seagull Managers�, uneducated managers lacking credentials, managers with MBAs but

Re: double sided reflow

Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca

Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe

Re: Thick film hydrids

Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc

Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t

Soldering to Immersion Tin surface finish

Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef

First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives


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