Electronics Forum: h and heald (Page 1 of 4)

MY15 and MY19

Electronics Forum | Mon Apr 19 08:58:09 EDT 2004 | pjc

MY15: 4080mm (160") L x 2000mm (78") D x 1450mm (57") H, 2500Kg (5500lbs) Wght. MY19: 4800 (188") L D & H dims same, 2800kg (6160lbs) Wght

Tooling and Stencil Design

Electronics Forum | Sat Dec 16 13:18:47 EST 2006 | Ola

Why not? If You think it has a bussiness case so go for it. We are currently using a firm that has 24h delivery time if neccesary (we need to order before 9'clock in the morning)and we once in a while use this for some prototypes. Their regular shipm

Pick and Place Machine

Electronics Forum | Wed Aug 17 12:14:52 EDT 2011 | emeto

We hacve Juki and I have to admit that they are very good machines. These machines are not very fast(I don't know how different is 2080. 1080 aned 2060 are almost the same and their real speed is about 6000cpm/h. Besodes that fact the machines great

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef

RoHS Substance RoHS MCV Limits Typical Testing Approaches Lead 1000 ppm* Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy XRF (X-ray fluorescence) spectroscopy Cadmium 100 ppm Wet

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1

Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai

CSP and BGA soldering difference.

Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris

Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen

Difference between NXT2 and NXT3

Electronics Forum | Mon Jan 18 02:49:03 EST 2016 | nirmex

1-Machine speed. 2-New Head H24 and DYNA Head. 3-New Feeder type W08f 4-New Part Camera. 5-New Y-Axis Flat cable design. 6-New GUI with Touch Screen. 7-Panel Height detection. 8-Feeder raising detection. 9-NPI tools support. 10-Overall machi

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ

Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24

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