Electronics Forum: had (Page 386 of 728)

MyData TM8FC magazines

Electronics Forum | Fri Jul 07 13:11:39 EDT 2006 | fredericksr

The recommended feeder for 0402s and especially 0201s is the green feeder with a 3.7mm spec. We use greens for 0402/0201, white for 0603, yellow for 0805s, and reds for tantalums. They work well, but sometimes you seem to get difficult tape. I hav

Low Flux Residue Solder Paste

Electronics Forum | Tue Jun 20 10:26:07 EDT 2006 | samir

Chunks, I used to work in power electronics, and we had this design engineer who used to "blow moisture" on the high-impedance circuit and test for cleanliness. We were water washing in a OA-Water Soluble environment. He was convinced that there w

Wire to board soldering

Electronics Forum | Mon Jun 19 08:45:55 EDT 2006 | dougs

Hi All, We have a board that's going through our process at the moment, it's 1.6mm thick and has 4 wires soldered into it, these are 10SWG multi stranded wires, i'm finding that it's difficult to get the holes filled with solder as it travels up

BTU VIP70 3 Phase supply

Electronics Forum | Mon Jun 26 03:56:44 EDT 2006 | slaine

hi I had a hunt round this morning and found all the schematic drawings for the vip70. Have you got a copy of them? where abouts in the uk are you im in Cumbria. drawing 5061617 appears to show some different wiring configerations, but im not sure if

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

Ag/Pd Component Finish

Electronics Forum | Thu Jun 29 06:26:36 EDT 2006 | AR

Hi Slaine, The terminations are still present on the component but all the solder (including the pad finish) has coalesced on to the terminations. The termination that normally is shiny and bright in colour has turned matte grey on that zone where t

Ag/Pd Component Finish

Electronics Forum | Fri Jun 30 06:07:12 EDT 2006 | slaine

Hi If all the solder has collected onto the component termination then it sounds more of a PCB problem then a component problem. Some times all the temination can be stripped off the ceramic with high tin content solders and leave a gray finish behi

Nitrogen purity requirments

Electronics Forum | Fri Jun 30 09:03:09 EDT 2006 | Frank

The manufacterer of our machine recommends 99.999%. At their presentation before we purchased the machine they showed an example of using different purity levels. When they whiched the supply to 99.99 and then to 99.95 you can visibly see the diffe

Low volume prototyping

Electronics Forum | Wed Jul 05 16:01:53 EDT 2006 | Chunks

I agree with Grant. The MYDATA machines we had were very easy to program, adjust and as Grant states make them pick up from just about anything. The best part of them was using partial reels or strips of parts. These machine don't care about havin


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