Electronics Forum | Sat Jul 24 23:18:00 EDT 1999 | Scott McKee
| We are going to smt ic's on the component side of our pcb's. | The problem is we are going to have to do this by hand. | We have a hot air station and vac pencil, but How reliable is this process. | We've tried it on proto's and had some shorting p
Electronics Forum | Thu Jul 29 11:39:34 EDT 1999 | Justin Medernach
| We are going to smt ic's on the component side of our pcb's. | The problem is we are going to have to do this by hand. | We have a hot air station and vac pencil, but How reliable is this process. | We've tried it on proto's and had some shorting p
Electronics Forum | Mon Jul 26 00:20:50 EDT 1999 | HERMAN
| Has anyone had the experience of losing components after they have been placed by the HSP 4796 because of table movement. I've worked on the 4760s, 4780s, and 4785. I don't know if this is a problem or not. We are trying to determine if this a poss
Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven
| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s
Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)
| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |
Electronics Forum | Fri Jul 16 14:42:36 EDT 1999 | Glenn Robertson
| I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many type
Electronics Forum | Thu Jul 15 16:59:57 EDT 1999 | Glenn Robertson
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Tue Jul 06 12:45:28 EDT 1999 | JohnW
| I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so, how did you
Electronics Forum | Sat Jul 10 00:57:17 EDT 1999 | Scott
| who can tell me how viscosity measurements are really effective in smt process control? what can I monitor? Is it depending from fine pitch size? | Thanks a lot. | g. d'andrea | The last place I worked used a viscosity meter, funny how little was
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
