Electronics Forum: had (Page 496 of 728)

Predictive Models for solder defects

Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted

I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol

Re: Univariate regression model?

Electronics Forum | Sat Jul 25 01:15:54 EDT 1998 | Chiakl

| | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wav

Re:Re: Univariate regression model?

Electronics Forum | Mon Jul 27 13:54:25 EDT 1998 | Ted

| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For

Re: Univariate regression model?

Electronics Forum | Mon Jul 27 13:49:53 EDT 1998 | Ted

| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For

Re: real placement rates

Electronics Forum | Thu Jul 23 07:33:28 EDT 1998 | The Wretched SMD

200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother with 04

Re: Treading on dangerous ground

Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette

| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r

Re: My advice is DON'T

Electronics Forum | Mon Jul 20 15:11:34 EDT 1998 | Scott McKee

| QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or

It happens sooner or later

Electronics Forum | Fri Jul 17 11:31:15 EDT 1998 | Ben Salisbury

Everyone- I've been involved in about 20 forums, Based on a whole range of different subjects. This one, although one of the best run and the most professional that I've experienced. It has run into a problem that almost all do...Ranting and raving

Re: $.02 on DEK 265 GSX PRINTER

Electronics Forum | Fri Jul 17 06:49:28 EDT 1998 | smd

| Have you tried the TETRA frame with exchangeable stencil foils? | See how the TETRA frame works by looking at www.micromet.co.uk. | The frame to use with the DEK is now available in the U.S. | Call me at (408)562-2033 for more information. | You'l

Re: Placement of 0201'

Electronics Forum | Mon Aug 03 20:17:43 EDT 1998 | Dave Kalen

(fishing).. | Has Sanyo developed a bulk feeder for 201's and do you feel that bulk feeding will be the next big move in placement equipment? | In New England people are talking bulk feeding, but few people have elected to go that way. | As wit


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