Electronics Forum | Sun Jun 23 12:24:37 EDT 2002 | stepheno
I worked at a place where a customer complained that the resistance of some components was lowered. It was found to be flux entrapped from the wave solder process. The tube of epoxy, didn't have a date of manufacture, shelf life, or use by date on
Electronics Forum | Tue Jul 09 08:29:10 EDT 2002 | r_sturdevant
I agree with others here who have questioned the amount of solder and reliability of the joint when using this aperture shape. I have had experience with these with MELFS, and the main issue I've seen comes when cleaning the stencil - all those littl
Electronics Forum | Wed Jul 03 15:38:37 EDT 2002 | mantis
We have used MCs F4g and fujicam,and i can definetly recommend going with fujicam.Its GUI is very easy to understand and generating programs couldnt be easier.Although it will probably take a little while to adjust from MCS.F4g was fuji's attempt at
Electronics Forum | Mon Jul 15 00:21:46 EDT 2002 | tjyard
Frustrated? Where do I start. Our company just lost a contract assembly job we have been providing to Altera Corp for five years. They sent it overseas to China. We had to lay everyone off at our assembly facility. Yeah, you better learn to spea
Electronics Forum | Tue Jul 16 10:15:12 EDT 2002 | robbied
Hi, we have recently had some customer returns where the 44 pin j-lead ASIC devices exhibit green corrosion from the copper under the tin plating on the leads. These boards were in the field for around 4 years, with innadequate conformal coating pro
Electronics Forum | Thu Jul 18 15:20:17 EDT 2002 | dragonslayr
I suggest following the standards developed by IPC for DPMO (go to IPC. org for more info) Create your own benchmark, within your own environment, for the specific PCA, then do trend analysis, 6 sigma improvements, etc. For a rule of thumb benchmark
Electronics Forum | Thu Jul 25 03:01:25 EDT 2002 | martz
We experience e-test failure due to BGA problem. The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn. If it
Electronics Forum | Thu Aug 08 17:51:51 EDT 2002 | davef
'The emailer on Cold Fusion came that way and we have been soooo busy trying to make sure the Geary's is gone before the date code comes-up that we just haven't had time for munitia like that.' Well, I'd like to revisit that decision, given: * Volum
Electronics Forum | Mon Aug 12 12:05:35 EDT 2002 | russ
I use Paste for high temp balls and/or co-planarity/warpage issues. normally I only use paste flux for ball attachment. One down side to paste application is registration and volume anomalies with those little micro-stencils (for me anyway). Your
Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon
I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot
