Electronics Forum | Wed Oct 24 11:18:03 EDT 2007 | cyber_wolf
If you are talking about the REM oil sold for guns then I would not use it personally. B.T.W. REM oil has teflon in it. I quit using it on my guns because of its poor performance. It now resides in my garage...I use it to lube the axles on my push m
Electronics Forum | Sat Oct 27 12:52:58 EDT 2007 | gregcr
We do very little wave soldering, maybe once a week. We have been running a Novastar Spartan 8S for years with very good results. I do wish we had the wider 12S for the wider boards, but it has only come up once in 7 years. I think there is a lot
Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
Electronics Forum | Tue Nov 13 14:11:26 EST 2007 | ratsalad
We use SAC305 for solder paste, and we have been pretty happy with it. When we jumped in to this Pb-free business I was a little nervous due to all the horror stories you hear about the process changes. It's not that big of a deal (at SMT). Over
Electronics Forum | Sat Nov 17 10:24:17 EST 2007 | etienne
Hi, I can give my opinion in this topic since I worked with both machines. To say the truth, I would recommend neither machine. First of all, operating software is much quite the same for both machines. The TP9 is true that has a larger footprint ov
Electronics Forum | Fri Nov 16 08:33:46 EST 2007 | rgduval
For RoHS assemblies, we're spec'ing at least FR-406 for the higher Tg. We're currently requesting our customers to use ENIG finish, as we've had better luck with assembly in our process; but we're currently experimenting wtih lead-free HASL. As far
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Wed Dec 05 22:59:42 EST 2007 | er_pe
To be successful, and to yield quality products off any selective solder systems out there on the market today, DFX rules need to be enforced and followed. Lay-out is a one-shot process where as manufacturing of the PCBA is continuous. Obviously, muc
Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson
I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha
Electronics Forum | Fri Dec 21 15:50:54 EST 2007 | rwyman
Hi smtdude- I'm no expert at PoP (yet!) as we've only done a few weeks worth of experiments for a new customer but what i can tell you is 25-50% of the ball height (not diameter) is a good rule of thumb for the flux depth, at least to start. I can s
