Electronics Forum: had (Page 596 of 728)

Re: Tin-oxide deposits

Electronics Forum | Wed Oct 18 10:02:04 EDT 2000 | Jason Nipper

I know it's a tin residue because we have a Cheme in house who had a spectrum analysis performed in an outside lab. The waves parameters were out of control long enough to effect a number of units that are, we�ll can I say substaincial in a fiscal s

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C

Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind

How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Sep 27 08:50:51 EDT 2000 | Dreamsniper

Hi Guys, I've compared stencil printing adhesive versus acquiring a dispensing equipment. Had breakdown all the costs against each other. It end up that Stencil Printing Adhesive is more costly than equipment dispensing machine in the long term (5 y

Re: Capability Study for Solder Printing Process

Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F

Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May

Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Re: De-wetting on Immersion Silver finish board

Electronics Forum | Fri Aug 25 05:23:46 EDT 2000 | Wolfgang Busko

Hi Murad, like with many other questions it�s hard to judge without seeing the effect. Assuming that this site you�re talking about is well equiped with knowledge and that they handle their processes normally to everybody�s satisfaction it�s obvious

Re: Is AOI any good

Electronics Forum | Tue Aug 29 05:58:28 EDT 2000 | Chris May

Andy, I have been "evaluating" some AOI systems. However, some of these are actually SAOI (Semi Automatic Optical Inspection), which is not a problem if that is what fits your process and budget. You can buy a high end system complete with many cam

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: Component solderability problems TO263 package

Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles

It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a


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