Electronics Forum: had (Page 681 of 728)

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon

| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: To clean or not to Clean??

Electronics Forum | Sat May 29 16:56:26 EDT 1999 | Jeff Sanchez

| | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-

Re: To clean or not to Clean??

Electronics Forum | Sun May 30 10:15:34 EDT 1999 | Vic Lau

| | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a dou

Re: To clean or not to Clean??

Electronics Forum | Mon May 31 21:50:59 EDT 1999 | Dave F

| | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox

| | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: vibration during solder reflow

Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup

| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW

Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co

Re: Popcorn @ reflow

Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings

| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |


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