Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Fri Jan 31 14:35:48 EST 2003 | russ
I would go for the laminar flow as opposed to N2. The contour nozzle doesn't really work all that well even with N2. I knew I should of asked you if you had a contour, I was thinking laminar flow hence the dynamics input. Russ
Electronics Forum | Sun Jan 26 22:28:46 EST 2003 | iman
we had a project like this once. switched to using "genosolve" chemistry (US source, expensive) in conjunction with a degreaser machine, works fine if you can spend the money.
Electronics Forum | Mon Mar 17 15:51:35 EST 2003 | MA/NY DDave
Hi A GREAT come back!! After a Wait to see "Show and Tell" To change the topic you launched a little. Who has or has had, this ENIG problem??? A simple yes or no with some detail. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 07:26:22 EST 2003 | davef
Jodi We too have had little success with the approach described in the referenced paper. What method do you use?
Electronics Forum | Fri Feb 14 11:45:11 EST 2003 | SV
I was wondering if you guys had any experience with a distributed coverage Test and inspection strategy (Awaretest Xi) and could point me to technical studies in the field. thanks
Electronics Forum | Wed Feb 26 10:57:47 EST 2003 | larryk
Dave, I had to contact Circuits Assembly, but I got the article. I'm going to forward it on to Ryan. I think you're on to his problem with flux becoming entrapped in the epoxy. It plays along with Locktites suggestion of a longer soak on his profile.
Electronics Forum | Thu Feb 20 11:57:48 EST 2003 | mdm4ua
I placed a micro bga using flux paste and ran it through my oven and it came out as if someone had pushed down on one side. I can find no reason for this, has anyone ever seen this and how did you fix it?
Electronics Forum | Tue Feb 25 13:54:09 EST 2003 | slthomas
This might be a little more that you've bargained for, but have you had a look at IPC-S-816? Obviously it needs to be tailored to your process, your quality needs, etc.
Electronics Forum | Wed Feb 26 14:37:57 EST 2003 | russ
Never used U shapes for 0603 but have used them for MELF pkg. Never had a problem printing as long as area ratio is acceptable. So just out of curiosity, why U shape for 0603? Russ
