Electronics Forum | Tue Dec 26 10:54:37 EST 2006 | yusufgomec
We use hot air leveling (HAL) process in pcb production. HAL process is 3 steps. �n 1. step flux. 2. step is HAL. And 3. step is rinsing. As you know there is mustn't any flux after rinsing operation. Our flux chemical is water soluable. But there ar
Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen
Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Sat Jun 25 06:55:41 EDT 2022 | vopashainc
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