Electronics Forum | Thu Aug 01 06:09:01 EDT 2002 | mzaboogie
Hi Pete, The boards are HASL. The frequency is random. The solder balls are randomly deposited along the path of the select wave, not always along the component bodies. We are very careful regarding handling. There could have been contamination on s
Electronics Forum | Tue Sep 10 08:01:47 EDT 2002 | mpotter
Kevin If you want to go automated then why not take a look at the Philips ACM. It is the flagship for placing SMT and Oddform packages. We use Vacuum nozzles and Grippers to handle many truly oddform components.
Electronics Forum | Tue Aug 20 16:57:55 EDT 2002 | kenbliss
At the risk of sounding like a commercial, but most companies do not realize this exists and it is certainly needed. Bliss Industries now has trays and tray carts to support handling and storage of these oversize boards. Several sizes available but
Electronics Forum | Tue Sep 10 01:51:46 EDT 2002 | bentzen
Hi. The towel was red and white as the Japanese flag ! The issue was addressed to Fuji Japan and was handled there. Vision type 11 and 12 do not allow protruding nozzles, so for 0603 (1608) they can't be used. Regards Brian
Electronics Forum | Fri Aug 30 11:53:12 EDT 2002 | genny
Possibly this is tarnish? Silver finish requires a bit more care in handling or packaging - to avoid contact with sulphur which may cause tarnish. Some cardboard boxes gas out enough sulphur to cause a problem. Possibly look at your method of stora
Electronics Forum | Fri Nov 01 18:57:32 EST 2002 | slthomas
I guess I just don't see how it would benefit us any. We rarely remove a board from the conveyor unless it's coming out of an oven. And why would you put bare boards on a tray? Why not into a destacker that feeds your line, so only the edges of a
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Tue Feb 04 08:20:18 EST 2003 | roertner
This rule is very conservative depending on the epoxy you use and the subsequent handling of the board prior to reflow. You should use lead to pad contact area. Also be sure to look at part height and clearance on your flowsolder machine.
Electronics Forum | Fri Feb 21 12:52:05 EST 2003 | russ
Are you 100% positive that the parts are on before wave? I have found that asking an operator "were they there before?" does not always provide for an accurate answer. how is your handling before and after the wave process? Russ
Electronics Forum | Tue Mar 11 09:44:40 EST 2003 | pjc
Check with your state EPA on disposal of lead contaminated equipment. Or, your local Sanford & Son can handle it.
