Electronics Forum | Fri Aug 03 12:24:14 EDT 2001 | hinerman
I can only describe how the Grid Lok handles component variability. The compliant caps have an annular ring that is very soft and can mold to different shapes. If a component shows up where there was no component before, the outside of the cap bend
Electronics Forum | Mon Aug 06 16:08:57 EDT 2001 | seand
Hello Again John, Are you injecting a like material currently? How are you doing this with your current process? Is this material being used specifically because the customer identified it as such? If this is not a current process for you, how do
Electronics Forum | Thu Jan 13 13:51:37 EST 2000 | Michael Uganecz
Hello, I'm doing some research on frameless stencils/stencil frames and I'm looking for people's thoughts on them. I'm looking for any and all thoughts/opinions on how well they work or don't work. Some specific areas of interest: tensioning in one
Electronics Forum | Fri Dec 17 08:45:26 EST 1999 | Wolfgang Busko
Hi Henry, amoung all things that cause this funny effect the most effective measures in my experience were good PCB design (pads and equal thermal conditions for both sides of the components), placement accuracy and profiling, profiling, profiling. L
Electronics Forum | Tue Dec 07 22:25:45 EST 1999 | sin
Dave, the zero-defect is impossible through my understand in a high volume or proto run manufacturing. Base on theory i have read, yes of course it should be. but practical side of view, it is impossible. you are talking about plenty of variable to
Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.
Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow
Electronics Forum | Thu Nov 04 13:45:29 EST 1999 | Scott Cook
Hi Chris. Can't specifically address optos, but I have spec'd RH requirements and Temp requirements for new facilities I helped design for manufacturing here in FL (humidity center of the universe). For an overall benefit, I considered the potential
Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner
If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r
Electronics Forum | Fri Oct 22 09:44:42 EDT 1999 | John Bashe
The CCGA package is difficult to handle and automate in the assembly process. The leads can be fragile, and vision recognition of the package and leads is difficult. Special lighting and/or a special vision algorithm will probably be needed if you wa
Electronics Forum | Wed Oct 13 10:28:30 EDT 1999 | Clifford Peaslee
Jeff, Your cookies should not have been affected, but there was a problem in the conversion with the mysmtnet page, which has been fixed. Although there is a slightly different appearence in the display of the foruum, much of what is different is i
