Electronics Forum: has (Page 1146 of 1226)

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Wed Jan 05 11:11:09 EST 2000 | Dave F

Hey Pat: My responses are: 1. Does anyone have experience with the shelf life on immersion white tin? If so, how long can the boards be stored without adversely affecting solderability. I've heard one year. No, we don�t, because we turn boards fa

Re: Should I manufacture my own boards or outsource them?

Electronics Forum | Mon Dec 20 11:58:34 EST 1999 | Chris May

Mike, I can only reiterate what Wolfgang has covered. How have you manufactured these previously ? Were they small hand built batches and now you are ramping up production ? Does the $150K include materials or is it free issue ? If a manufacturer

Re: Should I manufacture my own boards or outsource them?

Electronics Forum | Thu Dec 23 17:24:18 EST 1999 | Deon Nungaray

Deon Response: Hello Mike, Although the trend now days is to outsource, in some cases building it yourself is a worthwhile process. From what you say your product seems pretty simple and mature, so it might be very cost effective for you to bring i

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko

Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu

Re: Solder Mask IPC Standard

Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW

| | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | PCB is FR4 | | | Solder Mask is LPI | | | Reflow and W/S Profile = Standard

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin

| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian

| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab

Re: adhesive for ptfe boards

Electronics Forum | Sat Oct 02 03:51:28 EDT 1999 | Brian

| | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | Many tahnks | | | Don't kno

Re: adhesive for ptfe boards

Electronics Forum | Mon Oct 04 04:37:57 EDT 1999 | Gian.D

| | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | Many tahnks | | | | |

Fuji America's instruction on PST file

Electronics Forum | Fri Oct 01 00:44:41 EDT 1999 | Hon Choi

If permanent set processing is used, designate the permanent set table name (PST). The Separator uses the PST to restrict the allocation of specified parts to certain feeder positions on the unit (device) table. The PST is mainly used for efficiency


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