Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Thu Sep 16 20:37:08 EDT 1999 | Dreamsniper
| | I am not familiar with the "mil" metric. How many inches is in 1 mil? | | | | ...or 10 mil? | | | | | 1 mil= .001 inches | 10 mil= .010 inches | Also, it has nothing to do with metric. I was also confused with this standard of measuring bef
Electronics Forum | Tue Sep 14 09:13:34 EDT 1999 | Chris McDonald
| | | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | | | | | Hi Chris, | | Why don't you process a double side reflow and use selective wave fixture for wave process. T
Electronics Forum | Wed Sep 08 14:31:48 EDT 1999 | John Thorup
| | Hello: | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven.
Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Wed Aug 18 21:24:55 EDT 1999 | Dave F
| CEERIS has been sending me flyers for some time, touting the value of their various studies and insights gained from digesting the facts contained within. The topics are indeed of great interest. My question is to whomever of you has purchased one
Electronics Forum | Tue Aug 17 19:42:28 EDT 1999 | Carlos Palacios
| Looking for users of the Emerald pick and place.Comments on that equipment would be greatly appreciated. QFP and micro-BGA placement, idiot proff software etc. | | We just got a good offer to use that equipment for our training center instead of o
Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)
| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |
Electronics Forum | Fri Jul 16 14:42:36 EDT 1999 | Glenn Robertson
| I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many type
Electronics Forum | Wed Jun 09 11:50:13 EDT 1999 | Cunli Jia
Scott, The SMT Forum has been a place for sharing equipment experience. It has served as a user group for all capital equipment, as well as material and supplies. We used to consider putting up an equipment forum but more users felt that everythin
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