Electronics Forum | Tue Aug 24 07:06:28 EDT 1999 | Brian
| This is out of the normal scope of this site but� | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Component Ide
Electronics Forum | Wed Sep 01 14:23:04 EDT 1999 | Dave F
| Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | TX | Mark | Mark: Jennie Hwang, a sometimes SMTnet visitor,
Electronics Forum | Wed Aug 04 13:39:44 EDT 1999 | Dave Weihrauch
Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental conditio
Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Fri Jul 23 10:33:14 EDT 1999 | Mark D. Milward
Has anyone had the experience of losing components after they have been placed by the HSP 4796 because of table movement. I've worked on the 4760s, 4780s, and 4785. I don't know if this is a problem or not. We are trying to determine if this a possib
Electronics Forum | Fri Jul 23 13:14:17 EDT 1999 | Steve Schrader
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | Mar
Electronics Forum | Fri Jul 16 11:29:59 EDT 1999 | John Sims
We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. Thanks in advance, John Sims
Electronics Forum | Fri Jul 16 14:36:40 EDT 1999 | ken
Jeff, if you have not already tried this, try a longer, more gradual reflow phase in your profile. This has worked for me to eliminate tombstoning during similar situations where non standard component pads were used. It may provide you a useable a
Electronics Forum | Sat Jul 10 12:18:10 EDT 1999 | Steve
| Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts. | Try http://www.winslowaut
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba