Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
Electronics Forum | Tue Jul 29 21:06:14 EDT 2003 | Dean
It is important to measure each brand by class. Example: Measuring a top of the line BTU vs. an entry level Heller would not be fair or solve your problem. Each maker has models to satisfy all market segments. I have both brands in my factory. I
Electronics Forum | Fri Aug 08 06:44:33 EDT 2003 | Matt Kehoe
Emergency!!! We have a small run (5) of very dense boards that have an immersion tin finish. They were built in April/May and have a heavy tarnish appearance on them, smd pads and through holes. We are being asked to apply ssd to the surface mount pa
Electronics Forum | Fri Aug 08 08:00:46 EDT 2003 | davef
Matt: You're correct. Do not mess with these boards. If the immersion tin [imm tin] is discolored, it will not solder with routine processes. Ask your customer to return the boards to his / her fabricator and have the imm tin replated. The fabri
Electronics Forum | Fri Sep 05 13:00:40 EDT 2003 | cabjerk
Hi: How simple or complex do you want? We run PFS software, but for our Feeder Maint we used access and just wrote a simple pgm and tied it into our PFS. What PFS gives us is how often the feeder is change out and this is used to base a feeder PM
Electronics Forum | Wed Aug 13 22:44:26 EDT 2003 | Dean
We have two major industry leading customers that are driving a lead free process. We have chosen to embrace it, invest in the technology and process and become a regional leader in lead-free process. Like most companies we kept current on the tren
Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea
I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which
Electronics Forum | Tue Aug 19 13:47:46 EDT 2003 | slthomas
What are you going to fill the chamber with when it needs to be opened? If you use air, will the evacuated components suck up any available moisture? I've never done anything like this with electronic components, but some of the more porous materi
Electronics Forum | Wed Aug 20 09:15:10 EDT 2003 | John S
My company is developing a product that will require solder paste to be printed on a piece of cast aluminum. The surface of the casting is not completely flat. It has been recommended that one way to work around this might be to use a screen instea
Electronics Forum | Thu Aug 21 08:47:34 EDT 2003 | caldon
Stan- One of our buildings (not our SMT line or components) Has Great Aircondition but can not regulate the humidity. The building is cool but Wet (No need to lick envelopes as they are already stuck together) from humidity. We went out and found th
