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HASL VS ENIG-How to Choose the Right Surface Treatment Method

https://www.ourpcb.com/hasl-vs-enig.html

HASL VS ENIG-How to Choose the Right Surface Treatment Method Skip to content Call Us Today:+86-311-87874960 | info@ourpcb.com Home About us Payment terms and conditions Custom Wiring Harmess PCB Manufacturing Manufacturing PCB Prototyping PCB Capabilities PCB Equipment PCB Gerbers PCB Assembly PCB Assembly PCBA Equipment Contact Us Home / HASL VS ENIG-How to Choose the Right Surface Treatment Method HASL VS ENIG-How to Choose the Right Surface Treatment Method We can deduce that among the various technologies applied . HASL ENIG HASL VS ENIG (Advantages and Disadvantages) Other surface finishes process Conclusion 1、HASL 1.1 Definition: The Hot Air Solder Leveling is often expressed in short as ‘HASL . The hot air soldering leveling enables soldering of a component more effectual. Initially, the HASL finish is applied to enhance solderability and also cover copper circuitries that are exposed . 1.2 HASL Finish It should not sound new to those individuals conversant with the industry that the HASL was one of the significant surface finish options for decades now, carrying advantages which

capabilities - PCB Assembly,PCB Manufacturing,PCB design - OURPCB

https://www.ourpcb.com/capabilities

(bottom copper<2OZ) 4 mil(Green),8 mil Solder Bridge Min Width(bottom copper 2-4OZ) 6 mil,8 mil Overlay Colour White、Yellow(printed character:White) Type of Surface Treatment OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP Selective Surface Treatment ENIG

IPC J-STD 001 Rev. F - CIS/CIT - Certification Solder Training Kit (HASL)

https://store.aciusa.org/IPC-J-STD-001-CISCIT-Certification-Solder-Training-Kit-HASL-P255.aspx

IPC J-STD 001 Rev. F - CIS/CIT - Certification Solder Training Kit (HASL) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home  >  Training Center  >  Electronics Manufacturing Training Kits IPC J-STD 001 - CIS/CIT - Certification Solder Training Kit (HASL) Available Discounts IPC J-STD 001 Workmanship Certification Training Kit buy 251 to 500, save ) certification program. Each kit contains two boards, HASL finish for tin-lead soldering, and all of the parts required to complete the IPC J-STD-001 Workmanship Certification for both CIS and CIT students (HASL) Price: $28.00 + Add to Cart IPC 7711/7721 - CIS/CIT - Certification Solder Training Kit (ENIG) Price: $125.00 + Add to Cart Categories There are no subcategories : $895.00 More Info IPC 7711/7721 - CIS/CIT - Recertification Solder Training Kit (HASL) 80085000 Price: $65.00 + Add to Cart IPC 7711/7721 CIS Rework and Repair (All Modules) 33002 Price

Electronics Manufacturing Training Kits

https://store.aciusa.org/Electronics-Manufacturing-Training-Kits-C33.aspx

(ENIG) 80083000 Price: $125.00 + Add to Cart IPC 7711/7721 - CIS/CIT - Certification Solder Training Kit (HASL) 80086000 Price: $125.00 + Add to Cart IPC 7711/7721 - CIS/CIT - Recertification Solder Training Kit (HASL) 80085000 Price: $65.00 + Add to Cart IPC 7711/7721 - CIS/CIT - Recertification Solder Training Kit (ENIG) 80084000 Price: $65.00 + Add to Cart IPC J-STD 001 - CIS/CIT - Certification Solder Training Kit & Terminals - Certification Solder Training Kit 80087000 Price: $25.00 More Info IPC J-STD 001 - CIS/CIT - Certification Solder Training Kit (HASL) 80081002 Price: $40.00 + Add to Cart IPC J-STD 001 - CIS/CIT - Recertification Solder Training Kit (HASL) 80081003 Price: $28.00 + Add to Cart Top Sellers IPC J-STD 001 - CIS/CIT - Certification Solder Training Kit (ENIG) 80081000 Price: $40.00 + Add to Cart IPC J-STD 001 - CIS/CIT - Recertification Solder Training Kit (ENIG) 80081001 Price: $28.00 + Add to Cart IPC 7711/7721 - CIS/CIT - Certification Solder Training Kit (HASL) 80086000 Price: $125.00

1 layer PCB prototype in China --- PCBWay.com

https://www.pcbway.com/prototype_pcb/1-layer-PCB-Fabricator-in-China.html

& High Quality PCB Reviews Thousands of real pcb customer reviews All reviews Miccrophone 2 Layers 1.6 mm 45*45mm HASL with lead 1 oz Cu $18 $12 / 5 pcs Wifi Module board 2 Layers 2.4 mm 178*32mm HASL lead free 1 oz Cu $357 $238 / 50 pcs Micromouse 2 Layers 1.6 mm 74*100mm HASL with lead 1 oz Cu $20 $13 / 5 pcs PLACA CONVERSION 1 Layers 1.6 mm 130*180mm HASL with lead 1 oz Cu $72 $48 / 5 pcs Contactor Board 2 Layers 1.6 mm 127.3*81mm HASL with lead 1 oz Cu $50 $33 / 10 pcs FR4 2 layer Front Panel for Metronome 2 Layers 1.6 mm 50*70mm HASL with lead 1 oz Cu $20 $13 / 5 pcs PCB Prototype the Easy Way! Instant Quote

2 layer PCB Fabricator in China --- PCBWay.com

https://www.pcbway.com/prototype_pcb/2-layer-PCB-prototype-in-China.html

1.6 mm 48*51mm HASL lead free 1 oz Cu $93 $62 / 5 pcs PINO NATALINO 2 Layers 1.6 mm 68.60000000000001*32.3mm HASL with lead 1 oz Cu $20 $13 / 5 pcs Car Alarm System 2 Layers 0.6 mm 324*67mm HASL with lead 1 oz Cu $63 $42 / 5 pcs Low power Solar system 2 Layers 1.6 mm 100*100mm HASL with lead 1 oz Cu $20 $13 / 10 pcs Refrigeration for Transportation 2 Layers 1.6 mm 190*163mm HASL with lead 1 oz Cu $177 $118 / 20 pcs 500 Watt RF Power Amplifier 2 Layers 1.6 mm 63.5 *112.5mm HASL lead free 1 oz Cu $48 $32 / 10 pcs PCB Prototype the Easy Way! Instant Quote & Order Online Capabilities PCB Capabilities PCB Assembly Service Quickturn PCB Fabrication SMD Stencils Prototype PCBs Products/Services PCB Instant Quote PCB FAQs PCB Prototyping Our Equipments Blog

https://www.smta.org/additive/files/Hess_Brian.pdf

. His career in Printed Circuit Boards started with a summer internship at Advanced Circuits Inc. in Hopkins, MN in 1996. At this internship Brian worked on process/product feasibility of peelable soldermask over selective nickel/gold through Hot Air Solder Leveling (HASL

SMT Processes Re-Certification

https://www.smta.org/certification/recertification.cfm

. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus

Leadfree

http://www.hellerindustries.com/leadfree.pdf

. ♦ Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221 : T, S, C, A Atmosphere: Nitrogen Temperature:240°C Large Unacceptable Void – Likely Due to Bad Wetting (Lead Free HASL Candidate) Solder Fillet with Void PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 17 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 9 Material . May require more aggressive Flux and/or No lead HASL finish • Drop in process for existing reflow equipment • Nitrogen cover gas will enhance wetting and appearance, but is not essential for adequate results

gas n2 gen 5.x flux mk3.5

http://www.hellerindustries.com/search.php?zoom_query=gas+n2+gen+5.x+flux+mk3.5&zoom_page=2&zoom_per_page=10&zoom_and=0&zoom_sort=1

% Sn finish Sn63Pb37, Type 3 1206, 0805, 0603, 0402 HASL SnPb over powder, No-clean flux all 100% Sn finish Cu pad The test vehicle designed is shown in Figure 1 ... Potential concern Voids. May require more aggressive Flux and/or No lead HASL finish Drop in process for existing reflow equipment Nitrogen cover gas will enhance wetting and appearance, but is not essential for adequate (Acceptable ball formation) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 9 of 24 Rev Level: ... (Future testing to be run with HASL Lead Free Pads) Tested 2 pastes: 96.5% Sn/3.5

Leadfree

http://www.hellerindustries.com.cn/leadfree.pdf

. ♦ Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221 : T, S, C, A Atmosphere: Nitrogen Temperature:240°C Large Unacceptable Void – Likely Due to Bad Wetting (Lead Free HASL Candidate) Solder Fillet with Void PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 17 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 9 Material . May require more aggressive Flux and/or No lead HASL finish • Drop in process for existing reflow equipment • Nitrogen cover gas will enhance wetting and appearance, but is not essential for adequate results

Microsoft Word - pan_APEX06.doc

http://www.hellerindustries.com.cn/pan_APEX06.pdf

% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1

White Paper Template

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Risk-Mitigation-in-Hand-Soldering-RRoush.pdf

). The test board is an IPC-J-STD-001 Rev F solder training printed circuit board with a LEAD-FREE HASL finish. Component is a fresh, 0805 surface mount component with pure tin solder contacts on a nickel barrier , it is acceptable for all three classes, if the delamination does not bridge more that 25% of the distance between plated-through holes or internal conductors. The test board is an IPC-J-STD-001 Rev F solder training printed circuit board with a LEAD- FREE HASL Rev F solder training printed circuit board with a LEAD-FREE HASL finish. Component is a fresh, 1/4W Axial Lead Resistor through-hole component with electrolytic copper plated wires and plated with pure tin. SAC305, a lead free alloy that contains 96.5

White Paper Template

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Risk-Mitigation-in-Hand-Soldering-RRoush.pdf

). The test board is an IPC-J-STD-001 Rev F solder training printed circuit board with a LEAD-FREE HASL finish. Component is a fresh, 0805 surface mount component with pure tin solder contacts on a nickel barrier , it is acceptable for all three classes, if the delamination does not bridge more that 25% of the distance between plated-through holes or internal conductors. The test board is an IPC-J-STD-001 Rev F solder training printed circuit board with a LEAD- FREE HASL Rev F solder training printed circuit board with a LEAD-FREE HASL finish. Component is a fresh, 1/4W Axial Lead Resistor through-hole component with electrolytic copper plated wires and plated with pure tin. SAC305, a lead free alloy that contains 96.5

Surface Insulation Resistance (SIR) Testing

http://www.soldertools.net/product_images/stencilquik/papers/SIRTestResults_Best%20Inc_Flux.pdf

. The daisy chain test cards are a single sided FR4 material with 1 oz. Copper and a HASL finish. The card pad size is .025 with a 1mm pitch

Surface Insulation Resistance (SIR) Testing

http://www.soldertools.net/product_images/stencilquik/papers/SIRTestResults_Best%20Inc_Paste.pdf

. The daisy chain test cards are a single sided FR4 material with 1 oz. copper and a HASL finish. The card pad size is .025 with a 1mm pitch

Solder Mask Removal with Laser | New Pad or Trace Rework at BEST Inc.

https://www.solder.net/services/mask-removal-new-pad-or-trace-definition/

.  In some cases BEST can get the selective metal surface finish or even HASL coating placed back on the board in select area. In other cases, pads may have to their shape or dimensions modified in order to modify the design or have a lot of boards modified in order for their design to meet manufacturability and yield standards

IPC A-6012 Certified IPC (CIS) Specialist at BEST Inc.

https://www.solder.net/training-courses/ipc-a-6012-cis-training/

. Provides default performance requirements for printed boards. Provides requirements for final finishes and coatings (e.g., ENIG, OSP, HASL, ENEPIG

automated optical inspection machine -PCB magazine loader,PCB Multi Magazine Loader,pcb conformal co

https://www.ascen.ltd/Products/auto_optical_inspection/515.html

. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background

B500 PCB optical inspection machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coat

https://www.ascen.ltd/Products/auto_optical_inspection/517.html

. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background

SMT Processes Certification and Six Sigma Greenbelt Courses

http://smta.org/certification/

to complete the online program. Over 5 hours of recorded instruction from W. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP

Workshops | SMTA International

http://smta.org/smtai/workshops.cfm

  • Insufficient   • Contamination   • New Specific Defects     • HiP     •Graping   • Pad Cratering   • CAF Conclusion Questions WS17    Surface Finish (HASL Alternatives) for Lead free PCB Applications NEW! George Milad, Uyemura International Corporation Monday the traditional realm of HASL and electrolytic nickel gold tab plating and require innovative solutions. This workshop will focus on the alternatives: electroless nickel/immersion gold, electroless gold, immersion silver, immersion tin, OSP, electroless palladium

日本スペリア英語_CID

http://seikausa.com/sites/default/files/documents/nse-lead-free-solder-english.pdf

thickness and smooth bright finish ■Good penetration of even small diameter holes SN100CL for Hot Air Solder Leveling (HASL) Excellent Fluidity Low Copper Erosion SN100CL wets fast but does not erode copper on through hole walls and shoulders. Immersion time

IPC Releases Revision D for IPC-6012 | IPC

http://ipc.org/ContentPage.aspx?pageid=IPC-Releases-Revision-D-for-IPC-6012

." There are many valuable additions to this revision, including updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage

No Job Name

http://ipc.org/4.0_knowledge/4.1_Standards/free/J-STD-003C-Amendment-1.pdf

. April 2014 IPC J-STD-003C - Amendment 1 1 Table1-1 Solderability Test Method Selection 1.8 Coating Durability – SnPb Containing (HASL and Plated and Reflowed SnPb . PBs that are less than eight weeks older than the date code on the lot, unless AABUS. Pb-containing surface finishes are HASL and reflowed plated SnPb

Service Support

http://qualitek.com/lead_free_process_asia.html

. Ag Immersion is becoming more common for lead free though OSP is also available with lead free performance. There is also led fee HASL What are WEEE and RoHS

Service Support

http://qualitek.com/lead_free_process.html

. Ag Immersion is becoming more common for lead free though OSP is also available with lead free performance. There is also led fee HASL What are WEEE and RoHS

http://www.zestron.com/fileadmin/Filestorage_US/zestron-news/Zestron_News_March_2012.pdf

. Traditionally, the pad surface is coated with solder by Hot Air Solder Leveling (HASL). The HASL finish prevents oxidation of the underlying copper and therefore guarantees a solderable surface . Although this is a sound approach, OSP’s have become prevalent in the electronics industry as a comparable alternative to the HASL process

Naveen Ravindran, ZESTRON Americas, to Present at SMTAI - ZESTRON Americas

http://www.zestron.com/us/news/press-releases-zestron-americas/detail/naveen-ravindran-zestron-americas-to-present-at-smtai.html

. However, as circuit complexity and component density have increased, HASL has reached its limitations, necessitating the need for thinner coatings

Infinity Engineering Specification Manual

http://islandsmt.com/wp-content/uploads/2017/02/DEK-Infinity-Engineering-Spec.pdf

boards. The lower quality boards have uneven Hot Air Solder Levelled (HASL) pads and features. The uneven surface texture and irregularities of these features and pads would cause dead zones, ie areas where there is no light and hot spots of light caused normal incidence and angles up to 25° • Indirect/Oblique lighting - producing angles from 25° - 50° 8 Engineering Specification Chapter Issue 1 May 00 INFINITY ENGINEERING SPECIFICATION KEY FEATURES Light from a normal light source HASL feature Surfaces

AX-301 501 front.indd

http://islandsmt.com/wp-content/uploads/2017/05/AX301-and-AX501-Brochure.pdf

• Hot Air Solder Leverled (HASL) • Bare copper with Organic Surface Protectant (OSP) • Electroless Ni / Immersion AU Minimum board dimensions (L x W

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