Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Tue May 19 17:49:47 EDT 1998 | Earl Moon
| | | Earl, | | | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe po
Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory
Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc
Electronics Forum | Wed Dec 05 17:23:41 EST 2001 | davef
Now there�s a conundrum. You want the �best way to clean leads�, but you want to use the worst type of flux for cleaning leads. You say, �20% copper exposed� � * What happened to the solderability protection during this two-year storage? Wouldn�t
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Fri Mar 09 01:48:26 EST 2018 | aemery
Unfortunately Gerber EZ is probably the one thing I know very little about. As an FSE with Speedline I only had one client at that time that was using it and an application engineer came in and helped them with it. Sorry I can't give a direct answer
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Thu Aug 24 15:12:29 EDT 2000 | Earl Moon
I don't entertain the forum like JAXSUN. I never have played games but for some humorous insights. I, when participating, never complained until management provided only more incentive to advertisers than forum members. That said, the following is a
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
