Electronics Forum | Tue May 15 15:15:53 EDT 2001 | ohboy
Hi all, I just discovered this forum and I'm very impressed. We have a vendor who recently stopped placing desiccants in the vacuum packaging for our pcbs. (Yes, it's on the dwg!) His reasoning was that the desiccants can degrade the finish on the
Electronics Forum | Tue May 22 08:43:05 EDT 2001 | ohboy
Wow! I'm going to apply for something at Desiccare, I think... I found similar things about desiccants, but mostly material related stuff, also some concerns more about the indicator card than the desiccant. Nothing conclusive. At the moment, I
Electronics Forum | Wed May 16 08:48:12 EDT 2001 | ohboy
I been a bunch o' places...! Some good, some bad, re-inventing the wheel in many cases. Our specs are pretty specific in a lot of cases, but that doesn't mean they always get followed. It usually becomes a case of "It's not quite right, but we rea
Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef
Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui
Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef
I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability
Electronics Forum | Tue Mar 25 11:43:48 EDT 2014 | sara_pcb
It is Solder Mask on Bare copper, The land finish is HASL as per MIL-PRF-55110G which accepts trace of HASL as acceptable. Wetting is acceptable. regards, R.Saravanan
Electronics Forum | Tue Mar 25 11:25:18 EDT 2014 | horchak
The first impression I get is that the mask was applied over dirty or contaminated copper. What is the trace and land finish on the PCB? You also appear to have a wetting problem.
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX
Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh
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