Electronics Forum | Wed Jul 14 10:46:58 EDT 1999 | John Thorup
it's just so slow. yesterday afternoon and this morning i have had to leave the site because the delays, timeouts and other errors. what's up?
Electronics Forum | Wed Jul 14 05:54:57 EDT 1999 | Larry Jeter
I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful
Electronics Forum | Sun Jul 11 19:05:53 EDT 1999 | M Cox
I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me MD Cox
Electronics Forum | Tue Jul 13 14:17:00 EDT 1999 | Scott
| I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me | | MD Cox | | Here's a few numbers to call, most are manufacturers that will have a Rep in your area: 3M
Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Fri Jul 02 07:55:52 EDT 1999 | Earl Moon
50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c
Electronics Forum | Wed Jun 30 12:16:33 EDT 1999 | Mike Peart
Give Mektronix a call at 905 791 9977 and talk to Joe or Claudio. have a good one | Does anyone know any good rep organizations in Canada that specialize in Pick and Place Equipment? Please send me their info. | | Thanks, | Dan |
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Sun Jun 27 12:24:43 EDT 1999 | Scott Cook
| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components
Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
