Electronics Forum | Thu Aug 22 23:18:03 EDT 2002 | mjabure
you're welcome. if you have any other questions you can e-mail me, my address here is mjabure@smtnet.com. Used to be a machine instructor for fuji.
Electronics Forum | Fri Sep 06 13:45:02 EDT 2002 | Cris Campos
To Scrap or not to Scrap? We have the answer to your problem. Visit http://www.circuit-techs.com for more information regarding Printed Circuit Board Repair, Rework & Modification in accordance to IPC 7711 & 7721.
Electronics Forum | Thu Aug 22 19:10:38 EDT 2002 | ppwlee
Has anyone done study or have feedback on 0402 placement capabilities of Europlacer Vitesse? What kind of common issues were seen when placing 0402s with the machine? We know the machine is rated for 0402s but don't know how reliable it is. Rgds, P
Electronics Forum | Tue Aug 27 01:19:38 EDT 2002 | zolasteven
Hi, I have a few questions regarding printed circuit board. What is the difference between the solder pads and the solder resist or mask? What is the purpose for the solder resist? What color is it? When printing solder paste should the paste be
Electronics Forum | Wed Aug 28 11:52:24 EDT 2002 | lysik
What kind of print problems are you Having? Off pad, Voids? Or is it slumping, etc? You really should be all set with OSP boards. If I can get some more specific info I could probably help.
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Wed Aug 28 19:36:29 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Fri Sep 06 09:44:13 EDT 2002 | mhunter
We have found the same problem recently. Is there somewhere that I can post images to, for additional observational opinions.
Electronics Forum | Thu Aug 29 20:00:32 EDT 2002 | iceman
Steve, I agree, you should expect to have better results from double sided reflow. It is more difficult to dial in a wave solder process for SMT components than a reflow oven. Besides that - adhesive is just no fun to work with.
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
