Electronics Forum | Mon Oct 02 16:38:20 EDT 2006 | lheiss
Brad, Thanks for the info. Now that I have my align data set correctly I'm having this problem. I've greased and realigned until I'm blue in the face. If I do a nozzle change then a function 30, press the nozzle on with my finger and do a functio
Electronics Forum | Thu Oct 05 12:52:34 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! Typically, we normally recommend testing the pot, and adding either Sn/Ag or just Sn to keep it at bay. One nice thing about the solubility of Cu in Sn based alloys is that it should reach a theoretical upper limit of about 0.1%. I
Electronics Forum | Thu Oct 05 11:48:00 EDT 2006 | Mario Scalzo, SMT CPE
Good morning all. We are able to offer some insight into the problem and offer a recommended reflow profile to solve this issue, but it really depends on the solder paste that you use, as different manufacturers use different boiling point solvents.
Electronics Forum | Thu Oct 05 12:51:27 EDT 2006 | john_smith
cn, Currently we have a DEK265GSX a DEK Infinity and a MPM UP3000 printers and previously had MPM Accuflex,MPM UP1500 and MPM AP24s. No advice for the UP3030. We always had to work on all of the MPM printers for one thing or another and every time we
Electronics Forum | Mon Oct 09 14:30:44 EDT 2006 | Brian
I agree with Chunks. Programming was much simpler. The 2D inspection is much better on MPM. I didn't have to use offsets on the MPM or the DEK very often, but did more on teh DEK. I didn't like the front justified stencils on the DEK. I also did
Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE
David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also
Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob
Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard
Electronics Forum | Tue Oct 17 17:25:36 EDT 2006 | stepheniii
It all has to do with charges being drained. IIRC the pink stuff won't build up a charge but doesn't drain it well. As for the need for mats, how are charges being drained now? I don't think you can have no charges building up. With ESD all you can
Electronics Forum | Thu Oct 19 13:38:29 EDT 2006 | SWAG
We use random local fids on our Universal equipment - (they don't create a centerline placement point). On your equip., maybe you could try to shoot/dive-bomb the QFP(s) all by themselves using the 2 "random" local fids as your baseline reference po
Electronics Forum | Thu Oct 19 14:20:18 EDT 2006 | sliebl
Something that I find unusual in some of the replies is the fact that local fids that are randomly dropped around the quad don't do anything for assisting the alignment of said quad. The only way that I am aware of the local fids being useful is if t
