Electronics Forum | Thu Mar 23 00:47:00 EST 2000 | Donnie DeYoung
Mark, If you find out anything please let me know. The only way we do it is by hand using a slotted spoon and dumping the lead and dross into a 3 gallon bucket and having it taken off site and recycled. It's a pain in the neck, and I don't like we
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
Electronics Forum | Thu Mar 16 09:01:28 EST 2000 | Ashok Dhawan
I am looking for suggestions on " How to remove solder Balls". We have some designs and tools where nothing can be done economically except to remove the solder balls manually. We are using "Probe" picks to do that job. Anyone who can suggest a bet
Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
Electronics Forum | Fri Mar 10 05:16:32 EST 2000 | Jeff
We have nozzles breakage troubleshooting since we uses the PANASONIC RMA nozzle on our MV2x Chip-shooter. Our nozzles are breaked in its opening, and cause components damages. Also, if anyone with experience in nozzles breakage with PANASONIC RMA No
Electronics Forum | Tue Jun 17 01:38:01 EDT 2003 | Dreamsniper
Hey fmonnette, What's wrong if I have a dry cabinet and baked all my components under 1-3%RH or say 5%RH regardless of their MS Level, whether they r level 4, 5, 5a, 6 etc.... What will be my problems in doing that process? just for curiosity, th
Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann
To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h
Electronics Forum | Thu Mar 02 14:33:26 EST 2000 | Doug Philbrick
I have a customer wanting to hide the identity of a particular component on a PCB assembly. The product cannot be potted and since the PCB is the product he doesn't want to pour over that one chip for aesthetics reasons. Any ideas on ways to permanen
Electronics Forum | Fri Mar 03 14:01:49 EST 2000 | dean
This technique is commonly known as "black boxing". The majority of IC's are marked with ink. Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. This will work with Laser marked parts as well. If your volum
.gif)
