Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell
Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia
Electronics Forum | Fri Sep 22 08:37:07 EDT 2000 | Erick Russell
For any rework machine a good optics system is important. A look-up look down is used for BGA components. 30X magnification is required for flip chip, MicroBGA and fine pitch QFP placement. Digital cameras are not required, CCD have a good enoug
Electronics Forum | Thu Aug 24 16:44:27 EDT 2000 | Dr. Ning-Cheng Lee
There is no IMC composition can be identified in phase diagram of In/Sn. There are some compositions such as In3Sn or InSn4 cited in earlier literature. Those composition should be regarded as approximate representation of solid solution of In/Sn. I
Electronics Forum | Wed Aug 23 16:57:10 EDT 2000 | Dr. Ning-Cheng Lee
Regarding solder paste printing, many books available on the market all have some sections addressing this topic. Unfortunately, as of today, solder paste printing has not been the main theme of any book yet. I consider the better sources of informat
Electronics Forum | Thu Jul 20 17:10:11 EDT 2000 | Darby
It's six in the morning here! Give me a bell the next time you are out here and I'll take you fishing on the sensational Sydney Harbour. However I will not be getting out of the boat and "diving" - too many noahs arks. I'll leave that to the daredevi
Electronics Forum | Thu Jul 20 14:16:42 EDT 2000 | Bob Willis
Only used adhesives once and it was a disaster. I don�t rearly have much experience but the real problem is everyone wants to compare adhesive with solder and they will not give the same results. There is a good book on adhesive check out my book re
Electronics Forum | Thu Jul 20 13:23:30 EDT 2000 | Ross Clunie
Bob We are just starting to look in to this process and have been told that it can't be done using a stencil to print the solder paste onto the PCB (of course it was by an equipment manufacturer trying to sell a paste dispnecer). Is this a far commen
Electronics Forum | Thu Jul 20 12:56:45 EDT 2000 | Bob Willis
That�s a good question which I will leave to others to debate further. I feel that there will be a need to examine and understand all the issues with lead-free and have as many practical solution as possible ready rather than waiting. There are sti
Electronics Forum | Thu Jul 20 16:40:32 EDT 2000 | armintan
Do present reflow and wave solder equipment currently processing tin-lead process need to be replaced when migrating to lead free process ? Is there any equipment (reflow or wave) out there capable of processing both leaded and unleaded processes wh
Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis
The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m