Electronics Forum | Fri Jan 25 17:33:52 EST 2002 | barryg
I do not know what this plating is, I would check your service manual, or contact the machine manufacturer, our wave machines use titanium fingers, which i believe are not plated. If yours are plated you should be able to contact the manufacture, and
Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech
I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time
Electronics Forum | Thu Jan 31 14:06:37 EST 2002 | bdoyle
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Electronics Forum | Tue Feb 05 09:19:27 EST 2002 | Carol Stirling
Would someone be able to direct me to information on residual BGA stress please? I've been told that mounting the BGA involves residual stress to the solder balls due to different expansion characteristics of the BGA versus the board at the moment of
Electronics Forum | Tue Feb 05 22:19:52 EST 2002 | davef
Residual stress is not limited to BGA balls. I have residual stress. It does not leave until I start singing Led Zepplin songs at the top of my lungs. And for that to start, I need a good hour of staring at the bottom of a frosty mug at Jimbo's Lo
Electronics Forum | Fri Feb 15 02:49:35 EST 2002 | nifhail
What are the consequences of having the Moisture sensitive component to be overbaked. Say if the specs. calls for 125 C +/- 5 C for 48 hours, but they components were accidently left in the oven during a weekend, wih the oven still operating, to make
Electronics Forum | Tue Feb 19 11:34:04 EST 2002 | AndyC
Do you mean middle height slice ? . This is a term used to describe the x-ray taken at a mid-ball position on a BGA ball , ie , the "fattest/widest" part if the ball . This is generally done to see if voids contained within have led to fracture acros
Electronics Forum | Tue Feb 19 18:35:05 EST 2002 | dougt
I was asked by a mechanical guy where the industry standard was for designing a chassis for an ISA/PCI backplane board that we are going to use. We typically use a chassis built by an outside manufacturer but they have decided to build our own. Wel
Electronics Forum | Wed Feb 20 10:28:38 EST 2002 | jax
Silver in paste is usually employed to prevent scavenging of silver from silver plated surfaces, BUT Dave's right. I wouldn't think Components are uniform enough to base a process change on. See how it goes with what you have. You will probably find
Electronics Forum | Fri Feb 22 15:16:24 EST 2002 | rkevin
Bet your using tin/ lead plated components with a lead free Cu/Ag/Sn alloy. It leads to intermetallic cracking. Wow didn't anyone tell you to check the archives yet, It seems to be the answer given to everyone. Why have an interactive site if you alw
