Electronics Forum: have (Page 2031 of 3473)

Agilis Feeders

Electronics Forum | Wed Apr 23 07:19:12 EDT 2003 | bernard

Hi pete, We have being using the 8mm agilis feeder for nearly 12 months now, and contary to what you are finding the great advantage of this Mydata feeder system is that we loose very few components, you need no lead in etc. ( compared to other mach

Voids in solder fillet

Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ

What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to

Steaming boards

Electronics Forum | Tue Apr 22 13:05:01 EDT 2003 | Mr. B

I am curious on some opinions on cleaning of boards. We have a board wash but after the wash we still need to stem them for better cleaniness. The timed steaming is prox. 2 mins a side and by the way this is a medical board. So if you got and suggest

Amistar Feeders

Electronics Forum | Thu Apr 24 09:53:57 EDT 2003 | paul_bmc

I am looking for somewhere other then Amistar in San Marcos, CA to purchase Amistar / Tenryu feeders for PlacePro 5630, 5720, 5800 machines. I have tried numerous used equipment dealers but can't seem to find anyone that has anything. Does anyone o

Tombstone defect

Electronics Forum | Mon May 05 18:48:23 EDT 2003 | Kris

Hi, It is expected that lead-free will have reduced tomstoning. As it has a higher surface tension and does not wet as well as the tinlead paste it exibit lower tombstoning. Addiotnaly commercialy available lead-free alloys may not be true eutectic

Tombstone defect

Electronics Forum | Fri May 30 18:30:32 EDT 2003 | russ

Okay, Okay, I will convert to the metric system. I would still rather say 1 mm instead of 10 microns. As far as paste how about "really little" and "really really little" (type 3 and 4 respectively) This term (micron)is good for people unlike me t

Silly Attrition Levels

Electronics Forum | Thu Nov 06 16:26:38 EST 2003 | Rocky

I would just like to add that here at 3M we have worked with various equipment manufacturers in resolving issues of psa cover tape delamination due to higher tension feeders or adhesive build-up in collection bin type feeders. If anyone is interested

Specifying Surface finish on a BGA Module

Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef

ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take

Visual Fail / No Pick

Electronics Forum | Tue Apr 29 03:29:01 EDT 2003 | chrissieneale

Does anyone have any figures on visual fail / no pick? our machine records this but no one has been recording the machine and it's been running since we've had it (a good few years). I am currently assuming it's about 0.2/0.3% but this is a (not very

MELF component/solder failure

Electronics Forum | Tue May 06 14:52:37 EDT 2003 | bremerg

Pictures are now located at http://www.stevezeva.homestead.com/ These components are 2W resistors that only see 1/2W at max. during normal use. I have contacted IRC still wqaiting for a response. The resistors were tested as good. But the circuit


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