Electronics Forum: have (Page 2461 of 3473)

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland

| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon

| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Tue May 04 14:42:58 EDT 1999 | Chrys Shea

| | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I wi

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 07:53:48 EDT 1999 | Timothy O'Neill

| | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill

| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus

| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea

| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.

| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F

| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi

Soltech Sorrows...

Electronics Forum | Sat Mar 06 18:09:31 EST 1999 | Steve Gregory

Hi Ya'll... I'm in here again today trying to deal with my down wave solder. I've been beatin' my head against the wall for the last couple of days, it's a Soltec Prisma and the conveyer keeps jamming. What it's doing is up at the exit end where th


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