Electronics Forum: have (Page 26 of 3473)

Just wondering have anyone tried to build two/three same boards in parallel of one SMT line...

Electronics Forum | Thu Dec 10 16:47:02 EST 2020 | spoiltforchoice

Unless the boring big job is conveniently in a panel the same size as the other jobs you want to put through you really need to break it into 2 lines surely? Anything else is just a pain to manage. Longer term you could look at getting another Yamah

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Wed Dec 15 07:12:20 EST 2004 | vinitverma

Does Serge need bacons or turkeys?? None of them?? Then let him think about which machine suits his requirements! Throughput, flexibility, large board handling, output derating across board size variation and component size variation! Future proof -

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Thu Dec 16 01:30:33 EST 2004 | vinitverma

I respect your statements about the FCM-I but only partially. Yes it was meant for ONLY HIGH VOLUMES, but in those cases, it has proved to be a masterpeice. Talk to those who've used the machines for 70000 hours or so. I have customers here that're u

Does anyone have experience retrofitting a HELLER oven to a lower voltage?

Electronics Forum | Mon Sep 28 09:31:43 EDT 2015 | proceng1

Proc > > My field service back ground included > Electrovert so I know reflow electrical quite > well. I've worked on Heller, Conceptronic and > Vitronics over the last few years and really > there isn't a huge difference if you can read a > sc

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Wed Dec 15 00:18:01 EST 2004 | vinitverma

Hi Serge, If you are really looking at a new machine, why not try Assembleon AX-3 configured for 45K cph (rated speed, 30K IPC9850 speed). This machine can be future upgraded upto 90K cph (rated speed, 60Kcph IPC 9850 speed). You get placement force

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci

The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Thu Nov 22 23:46:27 EST 2018 | jaypark

Some PTHs on a board in the product I am building are not filled enough to meet the IPC-610-F requirement(at least 75% vertical fill) . I have no access to the solder source side due to something installed right beneath it. In order to completely

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef

Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Fri Nov 23 11:40:21 EST 2018 | dalsenkenneth

I hope someone would be able to help with this.

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon

IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.


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