Electronics Forum: have (Page 2601 of 3473)

An example of a good

Electronics Forum | Tue Sep 24 12:36:41 EDT 2002 | robf

But if the respondent could still click on the original poster's name he could contact him directly. If they are able to come to a conclusion between them that's great; if not, they could start a new thread and re-address the original or revised iss

SPC for MPM UP1500 Stencil Printers

Electronics Forum | Thu Sep 26 11:04:34 EDT 2002 | mcmilse

This is a general question just to see what people may be doing to control the stencil printing process. I am new to the stencil printing process and as the subject line states I am looking to set up an SPC plan for my MPM UP1500. Now I have a few

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Feeder tape size

Electronics Forum | Fri Sep 27 10:01:25 EDT 2002 | stefwitt

chips up to 1411 ( I have not seen a 1411 component yet, but 1210 is a good number ) in 8 mm, IC up to SO8 in 12 mm, IC up to SOL 20 fit in 16mm tape. This is just a basic rule. You may also find SO 20 in 24 mm tape. More important is the reel width,

Feeder tape size

Electronics Forum | Fri Sep 27 15:24:17 EDT 2002 | davef

This is too painful. I think you should be much more clever [some might say deceitful]. Call your contract house: * Tell them you have a new ISO/IEC Flimeral requirement for process control documentation that has been laid on you by a VEEEERY impor

BGA void removal

Electronics Forum | Wed Oct 09 16:59:35 EDT 2002 | davef

Russ, as I told Eric the other day ... The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This prov

BGA void removal

Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef

Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't

baking boards, revisited

Electronics Forum | Tue Oct 01 16:33:33 EDT 2002 | slthomas

I know, I know. It's not a "solution", per se, because it's a bandaid for bad fabrication, packaging, and storage practices. Still, it's a reality with our overseas CM that has a plant in a very humid environment. Is 16 hours @ 105C the safe way to

baking boards, revisited

Electronics Forum | Wed Oct 02 11:29:05 EDT 2002 | slthomas

Yeah, like I haven't been hearing that for the last two months. Hey, Steve, got a passport? Hey, Steve, you like chinese food? Hey, Steve, let me know if Xiamen is really just like San Diego! :P I found some other stuff on Technet (courtesy of Jac

0201 Aperture design

Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy

Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p


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