Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan
I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F
Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati
Electronics Forum | Mon Feb 07 19:49:50 EST 2000 | Tony Di Mauro
Jose, I have seen this defect before. We called it re-reflow. We found the part was originally attached at SMT. Later on after seeing a heat cycle at the wave machine the leads would de-attach causing an open at In-Circuit Test. Resolution was t
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Fri Jan 28 06:01:13 EST 2000 | k.s park
HI. Mr. Dave F First of all I appreciate your advise. Here is the answer to the question you sent. I was considering the solder inspection m/c for a long time. so i bought the LSM2 last year.i thinks it was good for me. further more Last year
Electronics Forum | Wed Jan 19 23:24:03 EST 2000 | armin
Hi, We have a couple of pcb's with PTH Crystal. We are looking for a spacer to be placed between the metallic body of the crystal and the via pad/land as they tend to short if wave soldered without a spacer. The spacer we are looking for is somethin
Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup
Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent
Electronics Forum | Thu Jan 13 13:16:40 EST 2000 | Dave F
Tony: You have choices: * Hi Temperature Tape: Go with Wolfgang ... too tough to control. * Selective Soldering Pallets: Some like 'em some don't. A lot of your success depends on the pallet fabricator. * Screenable Temporary Solder Mask: Wol
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
