Electronics Forum | Thu Oct 14 09:10:58 EDT 1999 | Clifford Peaslee
Thanks Dave, The participation column under the listing by message date and by author is the forums (ie. SMT, Component, etc) that the message is participating in. When replying to a message, the message will have the same "forum participation" as t
Electronics Forum | Mon Oct 11 12:58:21 EDT 1999 | John Thorup
| In a cost-reduction effort, our Design group is attempting to eliminate silk-screen (legend ink) on some new products. By the elimination of this process, there will be a slight decrease in the cost of the bare board. | | Presently, the silk scre
Electronics Forum | Mon Oct 11 13:17:36 EDT 1999 | Dave F
| A board shop rep contacted me about a process were solder paste is applied to the board as part of their mfg. process thereby eliminating the need for paste application at the assembler. This is a new one I have never heard of, but am willing to si
Electronics Forum | Mon Oct 11 06:43:13 EDT 1999 | rjk
Hello Brian Thanks for your quick reply. I should explain my situation. We are packing modules in trays for transport. We are currently using Conductive PS as material for the tray base. I am in the process of setting up a new company to manufacture
Electronics Forum | Thu Oct 14 08:01:48 EDT 1999 | JohnW
Gee Dave That's the first time I've ever seen myself listed for a quote! Brian, what your saying is on the whole right, on the surface of it the mask, as long as it's cured properlay shouldn't make a difference but I have to say that I've found so f
Electronics Forum | Fri Oct 08 14:01:27 EDT 1999 | C.K.
We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 70
Electronics Forum | Fri Oct 08 18:26:19 EDT 1999 | Dave F
| | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | PCB is FR4 | | Solder Mask is LPI | | Reflow and W/S Profile = Standard | | | | t
Electronics Forum | Sat Oct 09 07:38:43 EDT 1999 | Dave F
| | | Hi, | | | | | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | | | | | Thanks,
Electronics Forum | Thu Oct 07 18:24:01 EDT 1999 | Jason Gray
Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't already
Electronics Forum | Thu Oct 07 20:43:16 EDT 1999 | Dave F
| Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't alrea
