Electronics Forum: have (Page 3091 of 3473)

Re: Ceramic PCB's

Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon

| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ

Re: Flow for 2 sided SMT - Please Repost

Electronics Forum | Mon Dec 08 14:40:08 EST 1997 | Rin Or

| First Responses Lost: Please Repost | | Looking for info on process flow for 2 sided SMT with PTH | | on the top side. | | Both sides have large SMT ICs. I don't know what the best approach is; | | Epoxy, Paste in Hole, High temp paste. | | Any in

Re: Very Low Volume, Very High Mix Experience

Electronics Forum | Sat Mar 14 08:28:28 EST 1998 | Rudy

| I would like to hear from anyone producing high mix (~200 modules) with low volumes (5-2000 per year) using an automatic line running lot sizes in the 5-50 range. We are engaged in an investigation to invest in this capability. A view into the or

Placement Program Control

Electronics Forum | Fri Aug 03 22:20:49 EDT 2001 | jbull

Dave, We archive programs as follows. Step1. Perform a successful first piece article Step2: Copy the Program to a password protects network drive. Step3: Run the program in production, from the local drive Step4: After the production run, delet

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Mon Aug 06 09:15:01 EDT 2001 | gdstanton

|120 |140 |160 |180 |180 |190 |260 | with a belt speed of about 28 IPM. The uBGAs are placed parallel to each other along the smallest side. The small edges closest to each other are raised slightly and form a "hill" when looking from the horizon o

Wave Soldering Ceramic PCB's - a result

Electronics Forum | Wed Aug 15 06:16:30 EDT 2001 | JohnW

Ok so an update on the ceramic board. I've had some success but did have to cheet a little. So Dave, on the fluxing, your right we're not getting it all the way up the barrel and in the end as a short term fix we're dipping the lead's in flux not th

Micro BGA baking

Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef

Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen

Reflow Specs.

Electronics Forum | Thu Jun 13 11:24:25 EDT 2002 | davef

Sorry to hear about the Quality Department thing, but we all have our cross to bear, eh? Through an extended period, say 8 hours, understand change of critical controls in the following: * Conveyor speed. * Side to side temperature differences. * Ti

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI

We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The

Solder Pre-forms

Electronics Forum | Fri Aug 17 12:07:40 EDT 2001 | davef

We always get pissed-off a preform suppliers when they tell us that we need to do NRE to develop a preform. Is that BS er watt? Ya got this vanilla connector that everyone on the planet uses and we have to pay NRE. It's just a scam. Try Teka Inte


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