Electronics Forum | Wed May 22 10:27:33 EDT 2002 | stefwitt
Fiducial recognition on the Siemens machine works like the Mydata. Once you select this option, fiducials will be recognized when a new program is send. You can also select recognition as part of the feeder refill function mode. There is no automatic
Electronics Forum | Mon May 27 11:57:37 EDT 2002 | arcandspark
One thing you should do is characterize your reflow oven, run profile boards of various densities, say 2 gm/sq.in. to 10 gm/sq.in. Adjust the oven settings for these various boards to acheive your standard profile based on your solder paste manufactu
Electronics Forum | Tue May 28 00:06:08 EDT 2002 | caldon
IMO: Sanyo and Universal? maybe, maybe not would not make sense currently. UIC production is on a "reduced" schedule. To be introducing a new machine in manufacturing in these time would not be wise but who knows crazier things have happened. Conce
Electronics Forum | Fri May 31 03:45:54 EDT 2002 | robbied
The Flextac micro stencils I mentioned are not metal, but rather laser cut polymer, so not as easily damaged. As for cost, Even if you only re-use them 5 times and not the 10 that another company I know does, they only cost around �36 for a pack of t
Electronics Forum | Wed May 29 15:29:41 EDT 2002 | zanolli
Hello Peterson, If the contact tails protruded enough on the underside of the PCB, then you could do a "reverse" press fit. I do not believe that to be the case with the VHDM. Placement equipment is out of my bailiwick but; Usually small SMT connec
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Wed Jun 05 17:14:40 EDT 2002 | davef
First, I suggest that people search the SMTnet Archives in just about every response that I make. Second, you need to work on your DOE jargon * Factors. Independent or input variables * Effects. Results. Dependent or output variables. Third, the
Electronics Forum | Sun Jun 09 19:02:15 EDT 2002 | Ken G.
Sam, I can tell you right now that if you have a low volume hi mix application where the program/job is changing every day, an AXI system is not going to be a good fit. As you alluded to, the programming time is onerous, the fine tuning or tweaking i
Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
