Electronics Forum | Thu Jan 29 18:32:20 EST 1998 | Rin Or
| Using metal squeegees on GSPs has caused premature stencil wear. Has | anyone had any success with this combination? How much snap off did you | use? We are using .5 mm pitch and have a no clean process. I have been using lots of metal sqyeegee
Electronics Forum | Thu Jan 29 12:47:53 EST 1998 | Henry Lee
I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and double-sided boards. Can anyone po
Electronics Forum | Wed Jan 28 15:35:47 EST 1998 | Tommy Turner
| We have some trouble adding a IC head Nozzle to a | Siemens Siplace machine. | It seems like the machine don't want to recieve | new MA data, coz even if we restart the line | the old nozzle configuration will be used. | Anyone know what we do wron
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Mon Dec 08 16:10:02 EST 1997 | Donnacha Nagle
Q1. As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. Ultimately I will be setting up control charts on line. Does anybody have suggestions in this area ?, I have alot
Electronics Forum | Mon Aug 06 12:30:51 EDT 2001 | Brad R.
I am having some SMT assemblies undergoing thermal shock testing per MIL-STD-883, Method 1011, Test Condition B. I was wondering if anyone has a chart, equation, article, etc. that will give me an idea of the service life of the assembly after it su
Electronics Forum | Fri Aug 17 09:42:18 EDT 2001 | Hussman
G'Day All, I have a couple of new Panasonic MSR's. Whenever I load a new program into the machine, I have to manually feed the first PCB onto the X/Y table to get it to run. After that, they run just fine. Panasonic is going to be in and they hav
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
