Electronics Forum | Mon Feb 25 18:36:52 EST 2008 | jmelson
Our people have EXCELLENT reading skills, and for some stuff I do have a list of the order to assemble the parts, with some tricks, etc. called out. But, a color-coded assembly drawing is what we use the most. I use Sharpie markers to color-code th
Electronics Forum | Sat Mar 15 09:55:33 EDT 2008 | ppcbs
As a rework house to contract manufacturers, a majority of the BGA rework we receive is failing due to Black Pad issues. Recently we have been taking in a lot of consumer products that have parts just falling off the lead free boards that are assemb
Electronics Forum | Tue Mar 18 05:32:09 EDT 2008 | gregoryyork
What volume of boards are you putting through. 1Kg per hour does sound very high but then again it does depend on volume Using an antioxidant is a must with Lead Free some alloys have additions in them to start with but those drop out with use so th
Electronics Forum | Tue Mar 18 14:23:08 EDT 2008 | rrpowers
I don't doubt about not really needing the computer upgrade. I've seen the same thing from them before. (Although it was a Speedline tech that originally told me about the PastePuck system.) Unfortunately we have custom software (4.1h) that goes w
Electronics Forum | Thu Mar 20 18:39:30 EDT 2008 | cmckissick
I am not a big believer in these systems, unless you are doing a no-clean, multi-shift operation with minimum changeover. If you are a small batch shop, the amount of solder paste you end up wasting can actually be the same or more, if you are not r
Electronics Forum | Tue Mar 25 14:05:16 EDT 2008 | flipit
X7R >Z5U,Y5V. Y5Vs crack more than NPOs. Ceramic resonators crack often as well. I found that the chop style like the Fancord VPD5 is the lease stressful of the V-Score cutters. We have run as close as 0.025" to the edges with 0805s with no crack
Electronics Forum | Wed Mar 26 16:12:46 EDT 2008 | jlawson
If you have jobs where you can not, there is a company in Japan that makes the best v-groove depanelers called TST, 'guru's in v-groove depanelising'. Their systems can be supplied to reduce stress on cutting to near zero compared to CAB and other lo
Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Wed Mar 19 15:59:40 EDT 2008 | rmitchell
Hi, I am having some problems with my CP6 placement changing in the Y axis. I had to move all parts by +.12mm this morning. Then after 20 boards the placement shifted too high by about .12 mm The IP stayed the same with the same pcb's and fid coo
Electronics Forum | Tue Mar 25 12:08:53 EDT 2008 | ludee_circuits
My factory produces Printed Circuits Boards.Today, my customer says they encounter problem with solder ability issue. Some of the boards have difficulties during SMT solder flow. Could not stick to the pads and the components fell off. Those boards
